Organic light-emitting component

ABSTRACT

An organic light-emitting component, having a substrate, a first electrode arranged on the substrate, a layer stack that is arranged on the first electrode and that has at least one organic layer and a second electrode arranged on the layer stack. The layer stack is suitable for emitting electromagnetic radiation during operation. The component also has a receiver device, which is suitable for drawing energy from an alternating electromagnetic field and for converting this energy at least partially into electrical energy and for making this energy available to the layer stack.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of the German Patent ApplicationNos. 102006025115.6 and 102006033713.1, filed May 30, 2006, and Jul. 20,2006, respectively.

BACKGROUND

Light-emitting components and methods for producing such components aredescribed.

Organic light-emitting components usually have organic materials thatcan easily react with water and oxygen, which usually leads toaccelerated degradation of the components. In order to avoid contactbetween the organic materials and water and oxygen, organiclight-emitting components are typically encapsulated, as described, forexample, in WO 01/45140 A2.

In conventional organic light-emitting components, electricallyconductive lines lead outward from the components through or under anencapsulation for providing electrical contact to the component. Theelectrically conductive lines end at electrical contact surfaces, withwhich the component can be connected to driver electronics. Where theconductive lines lead through or under the encapsulation, a satisfactoryseal of the encapsulation can be difficult to achieve. The conductivelines can act as permeation channels and allow water, oxygen, or othercorrosive materials to penetrate from the outside to the organicmaterials.

SUMMARY

Degradation due to reactions with water, atmospheric oxygen, or thelike, can be reduced using the devices and techniques described herein.An organic light-emitting component includes a substrate on which anorganic light emitting device is located and a receiver suitable fordrawing energy from an alternating electromagnetic field, for convertingthe energy into electrical energy and transferring the energy to theorganic light emitting device.

A method for producing an organic light-emitting component, which has atleast one layer that includes an organic material and that is suitablefor generating electromagnetic radiation includes producing a layerstack on a substrate. The substrate and the layer stack areencapsulated, wherein the encapsulation is applied such that the outersurface of the component is free from electrical contact surfaces.

The method can advantageously allow the production of an especially wellencapsulated organic light-emitting component. In addition, the methodeliminates the exposure of electrical contact surfaces on the outersurface of the component in connection with the production of the layerstack, which is required in the production of conventional componentsand which can increase production time and costs.

BRIEF DESCRIPTION OF THE FIGURES

FIGS. 1A-1F are schematic cross sections through a plurality of organiclight-emitting components at various stages of formation,

FIGS. 2A and 2B, are schematic plan views of a component for the stagesof the method shown in FIGS. 1B and 1C,

FIG. 2C is a schematic plan view of a component according to a variantof the first embodiment,

FIG. 3A is a schematic cross section through an organic light-emittingcomponent according to another embodiment,

FIG. 3B is a schematic plan view onto the organic light-emittingcomponent of FIG. 3A,

FIG. 3C is a schematic plan view onto a variant of the organiclight-emitting component according to FIGS. 3A and 3B,

FIG. 4 is a schematic cross section through an organic light-emittingcomponent according to a third embodiment,

FIG. 5A is a schematic cross section through a device with an organiclight-emitting component according to a first embodiment,

FIG. 5B is a schematic cross section through a device with an organiclight-emitting component according to another embodiment,

FIG. 5C is a schematic cross section through a device with an organiclight-emitting component according to a variant of the embodiment ofFIG. 5B,

FIG. 6 is a schematic plan view of a cutout of a lighting deviceaccording to a first embodiment, and

FIG. 7 is a schematic plan view of a cutout of a lighting deviceaccording to a second embodiment.

In the embodiments and figures, components that are identical or thathave identical functions are each provided with identical referencesymbols. The illustrated elements and their size ratios relative to eachother are, in principle, not to be viewed as true to scale, but insteadindividual elements, e.g., layers and/or edges, can be illustratedexcessively thick or large for better representation and/or for betterunderstanding.

DETAILED DESCRIPTION

An organic light-emitting component includes a substrate, a firstelectrode, a layer stack, which has at least one layer that includes anorganic material and that is suitable for emitting electromagneticradiation during operation, a second electrode, and receiver device thatis suitable for drawing energy from an alternating electromagnetic fieldand for converting this energy at least partially into electricalenergy.

The substrate includes or is formed entirely of, for example, at leastone of the following materials: glass, a semiconductor material, such assilicon, a metal, such as steel or stainless steel, or a plastic, suchas poly(ethylene terephthalate) (PET), poly(butylene terephthalate)(PBT), poly(ethylene naphthalate) (PEN), polycarbonate (PC), polyimide(PI), polysulfone (PSO), poly(p-phenylene ethersulfone) (PES),polyethylene (PE), polypropylene (PP), poly(vinyl chloride) (PVC),polystyrene (PS), or poly(methylmethacrylate) (PMMA).

The substrate can be in the form of a plate or a film. In someembodiments, the substrate is a glass plate. In one embodiment, theglass plate has a thickness of greater than or equal to 0.5 mm and/orless than or equal to 3 mm. For example, the glass plate can have athickness of about 1 mm. In some embodiments, the substrate is very thinand/or flexible. For example, a flexible substrate is a thin glass platewith a thickness between about 50 and 100 μm. In some embodiments, thethin and/or flexible substrate is a film that includes metal and/or aplastic. The film has, for example, a thickness between about 50 and 400μm, such as between about 100 and 200 μm. Thus, for example, lightand/or flexible components can be formed.

If at least part of the radiation generated by the layer stack inoperation is to be transmitted through the substrate, the substrate caninclude a material that is at least partially transparent or translucentto the radiation emitted by the layer stack.

The first electrode is deposited over or directly on the substrate. Thefirst electrode can be either an anode or a cathode. If the firstelectrode is the anode, then it can include a material that possesseshigh electron work function, such as greater than or equal to 4.5 eV.The anode may include, for example, a metal such as Pt, Au, In, and/orPd, a transparent, conductive oxide, especially indium-tin oxide (ITO),lead oxide, and/or tin oxide, LiF and/or graphite, an inorganicsemiconductor material, such as Si, Ge, or GaAs, and/or a conductivepolymer such as polypyrrole, polyaniline (PANI), and/orpoly-3,4-ethylene dioxythiophene (PEDOT).

If the first electrode is the cathode, it can include a material withlow electron work function. For example, the cathode can include Ca, Mg,a magnesium alloy such as Mg:Ag, Yb, Ba, an aluminum alloy such asLi:Al, or a combination made from at least two of these materials.

In some embodiments, the thickness and/or material of the firstelectrode is selected so that radiation emitted by the layer stackduring operation is transmitted at least partially through the firstelectrode. If the first electrode is an anode, suitable materials are,for example, transparent conductive oxides, which are usually at leastpartially translucent or transparent to the radiation emitted by thelayer stack during operation.

Alternatively or in addition, the electromagnetic radiation generated bythe layer stack during operation can be transmitted through the secondelectrode, which is deposited on the side of the layer stack oppositethe first electrode. In some embodiments, the first electrode alsocomprises a metallic layer with good reflection properties for theradiation emitted by the layer stack. For example, the metallic layercan include Ag, Al, Mg, Ca, Pt, and/or an alloy that includes at leasttwo of these metals.

The second electrode can be either the cathode or the anode. If thefirst electrode is an anode, then the second electrode is a cathode andvice versa. Suitable materials correspond to those described for thefirst electrode. In some embodiments, the cathode includes a firstlayer, which includes at least one alkali metal and/or one earth alkalimetal. In some embodiments, the cathode also includes a second layerthat includes a metal, for example, Al, Ag, and/or Au.

The layer stack is deposited over or directly on the first electrode.The layer stack includes at least one layer and has at least one organicmaterial. The organic material includes, e.g., a low-molecular weightmaterial (“small molecules”) and/or a polymer.

The layer stack includes a layer that emits light during operation andincludes an emitter material, especially an organic emitter material.Suitable emitter materials include, for example, photoluminescent and/orelectroluminescent, fluorescent, and phosphorescent organic materialswith low or high molecular weight. The light that is emitted can beinfrared, visible and/or ultraviolet light.

Suitable materials with low molecular weight (small molecule materials)are, for example, tris-8-aluminum-quinolinol complexes such astris-(8-hydroxy-chinolinato)-aluminum (Alq₃), 1,4-bis(2,2-diphenylvinyl)biphenyl (DPVBi) and coumarines.

Suitable organic materials with high molecular weight are, for example,organic or organometallic polymers. These include polyfluorene,polythiophene, polyphenylene, polythiophene vinylene, poly-p-phenylenevinylene (PPV), polyspiro polymers and their families, copolymers,derivatives, and mixtures thereof.

In one embodiment, the layer stack also comprises a hole transport layeradjacent to the anode and/or an electron transport layer adjacent to thecathode. Such hole or electron transport layers are described, forexample, in US 2005/0158523 A1, the contents of which is incorporated byreference herein. The hole transport layer includes, for example, PEDOT,4,4′,4″-tris(N-(1-naphthyl)-N-phenyl-amino)-triphenylamine (1-naphDATA),and/or 4,4′-bis[N-(1-naphtyl)-N-phenyl-amino]biphenyl (α-NPD) or iscomposed entirely of at least one of these materials. The electrontransport layer includes or is composed entirely of, for example,4,7-diphenyl-1,10-phenantroline (BPhen), and/or Alq₃.

The organic light-emitting component is exposed to an alternatingelectromagnetic field during operation. The alternating electromagneticfield can be a time-varying electric and/or magnetic field. In someembodiments, the time variation is periodic. For example, thealternating electromagnetic field can be a high-frequency field ormicrowaves. In one embodiment, the alternating electromagnetic field hasa frequency between about 30 and 500 kHz, in another embodiment, afrequency between about 10 and 15 MHz.

The receiver device draws energy from the alternating electromagneticfield. The alternating electromagnetic field that the receiver isconfigured to receive and convert can be microwaves and/or radio waves,that is, electromagnetic energy with wavelengths longer than thewavelength of infrared light. The microwaves can be electromagneticwaves having a wavelength of longer than about 10⁻⁴ m, such as longerthan about 10⁻³ meters and the radio waves can have a wavelength oflonger than about 10⁻¹ meters. The receiver device is suitable for atleast partially converting the energy drawn from the alternatingelectromagnetic field into electrical energy and for applying a currentto the layer stack. Thus, the receiver device in operation makesavailable to the layer stack the electrical energy required forradiation emission. For this purpose, the receiver device can beconnected to the first and to the second electrode in an electricallyconductive way.

In some embodiments, the receiver device includes a coil, such as amicro-coil, and/or an antenna, which is provided for capturingelectromagnetic energy from the alternating electromagnetic field. Analternating electromagnetic field usually induces a voltage in the coiland/or the antenna, which generates a current through the layer stack ina circuit closed by the layer stack and optionally by other electricaland/or electronic components. A micro-coil has, for example, in crosssection, a height of less than or equal to 2 mm, such as less than orequal to 1 mm and/or a width of less than or equal to 5 mm, such as lessthan or equal to 3 mm. The length of a micro-coil equals between about20 mm and 50 mm in some embodiments; for example, in one embodiment, themicro-coil length equals 30 mm. In at least one embodiment, themicro-coil has a ferrite core.

A device (for example, a storage battery) that stores or accumulates theenergy drawn by the receiver device from the alternating electromagneticfield over a longer time span—that is for a longer duration than one ora few periods of the alternating electromagnetic field—is not necessaryfor the operation of the component. Instead, the layer stack ispreferably supplied with power practically in real time with the energydrawn from the alternating electromagnetic field.

The coil or antenna is arranged, for example, on the substrate, inparticular, the coil or antenna does not project past the substrate in aplan view onto the main surface of the substrate, i.e., the coil doesnot extend beyond an edge of the substrate. In some embodiments, thecoil or antenna is embedded in the substrate.

In one embodiment, the coil or antenna is arranged next to the layerstack on the substrate. In another embodiment of the component, aninsulating layer is deposited on the second electrode and at leastpartially covers the second electrode. The antenna can be arranged atleast partially on the insulating layer. For example, the antennacomprises one or more conductive lines. The conductive line or lines arevapor deposited onto the insulating layer in some embodiments. Theconductive line or lines can also extend onto the first and/or secondelectrode.

The antenna or coil has, for example, the shape of a spiral, forexample, a triangular, rectangular, hexagonal, or octagonal spiral. Fora triangular, hexagonal, or octagonal spiral, a winding of the spiralhas three, six, or eight corners. The corners of one or more windings ofthe spiral are rounded in some embodiments. Other geometries are alsoconceivable for the antenna.

In some embodiments, the antenna has two ends, of which, for example, afirst end is connected to the first electrode and a second end isconnected to the second electrode. Alternatively, at least oneadditional electrical or electronic component of the receiver device canbe arranged between the first end of the antenna and the first electrodeand/or between the second end of the antenna and the second electrode.Here, the additional component can be, for example, a resistor, a diode,a capacitor, a coil, and/or a circuit made from several components.

In some embodiments, the insulating layer covers an edge region of thesecond electrode and leaves exposed a middle area of the secondelectrode. In some embodiments, the second end of the antenna is thendeposited onto the middle area of the second electrode and iselectrically connected to the middle area. In one variant of thisembodiment, an edge region of the second electrode remains uncovered bythe insulating layer. In some embodiments of this variant, the secondend of the antenna is arranged on the uncovered edge region and iselectrically connected to the second electrode.

The insulating layer includes an insulating material, such as Al₂O₃,polytetrafluoroethylene, polystyrene (PS), and/or poly(methylmethacrylate) (PMMA) or is composed entirely of one of these materials.

Alternatively, the insulating layer can also be a self-assembledmonolayer. A self-assembled monolayer can contain molecular groups. Inparticular, it is composed of a monolayer of molecular groups. Amolecular group includes, for example, an anchor group, which issuitable for connecting to the second electrode. In one embodiment, themolecular group also includes a dielectric unit, which is arrangeddownstream of the anchor group on the side of the self-assembledmonolayer away from the second electrode. Such self-assembled monolayersand molecular groups are described, for example, in the publications DE103 28 811 A1, DE 10 2004 005 082 A1, and DE 10 2004 057 760 A1, thecontents of which are incorporated herein by reference. An insulatinglayer, which is a self-organizing monolayer made from molecular groups,can be produced particularly easily and has no or only a few defects atwhich the second electrode is not covered. It also has advantageously aparticularly high electrical resistance.

If the antenna is arranged on an insulating layer, which at leastpartially covers the second electrode, the radiation generated by thelayer stack during operation can be transmitted through the firstelectrode and the substrate (a so called “bottom-emitter device”).

In another embodiment, the electromagnetic radiation, e.g., infrared,visible and/or ultraviolet light, generated by the layer stack inoperation is at least partially transmitted through the second electrode(a so called “top-emitter device”).

In some embodiments, the antenna comprises a material that is at leastpartially transparent to the electromagnetic radiation emitted by thelayer stack, in particular, a transparent conducting oxide (TCO) such asindium-tin oxide (ITO) and/or a thin metal layer. In this case, at leastone part of the electromagnetic radiation can be transmitted through theantenna.

Alternatively, radiation emitted by the layer stack in operation canalso be transmitted through a first and/or second electrode, on which anantenna is arranged, even when the antenna is essentially nottransparent. In this case, the radiation is only transmitted through theportions of the electrode not covered by the antenna. For example, whenthe antenna covers only a small part, e.g., an edge region, of the areaof the radiation-emitting layer stack, electromagnetic radiation fromthe main portion of the layer stack is not blocked by the antenna.

In another embodiment, the antenna is arranged between the substrate andthe first electrode. An insulating layer, which at least partiallycovers the first electrode, is arranged between the antenna and thefirst electrode. In this embodiment, the electromagnetic radiationgenerated by the layer stack during operation can be at least partiallytransmitted through the second electrode.

In one embodiment, the receiver device is suitable for rectifyingalternating current. For this purpose, the receiver device includes, forexample, at least one diode. In one embodiment, the diode is connectedin series with the coil or antenna and the layer stack. In anotherembodiment, the receiver device includes a rectifier bridge, e.g., afull-wave bridge with four diodes.

In some embodiments, the receiver device comprises at least onecapacitor, which is used, for example, for smoothing the voltage or thecurrent. Advantageously, a very constant direct current can be injectedinto the layer stack, resulting in a very uniform emission. In oneembodiment, the receiver device comprises an oscillating circuit, whichcomprises at least the antenna and/or the coil and a capacitor. In someembodiments, the resonance frequency of the oscillating circuit is tunedto the frequency of the alternating electromagnetic field. Thus, energyis efficiently drawn from the alternating electromagnetic field.

In some embodiments, the diode, capacitor, and/or optionally otherelectronic components contained in the receiver device are miniaturized.

In some embodiments, a layer structure is arranged on the substrate thatincludes the diode, the capacitor, and/or other electronic components.The layer structure includes, for example, at least one organicsemiconductor layer, one inorganic semiconductor layer, and/or one metallayer. In particular, the layer structure is vapor deposited ordeposited by means of molecular beam epitaxy (MBE). The organic and/orinorganic semiconductor layer and/or the metal layer are structured,such as by photolithography. Semiconductor processing techniques can beused to form an integrated circuit of the semiconductor and/or metallayers. Thus, an especially small sized organic light-emitting componentis possible.

The diode, the capacitor, and/or optionally other electronic componentsare arranged, for example, on the substrate next to and/or above thelayer stack. In some embodiments, the layer structure is arrangedbetween the first electrode and the substrate or on an area of thesubstrate uncovered by the layer stack, that is, laterally next to thelayer stack. Alternatively, the layer structure is arranged on theorganic layer stack, on its side remote from the substrate.

In some embodiments, the organic light-emitting component isencapsulated. An encapsulating structure, such as a laminate or cap, isarranged on the substrate such that it covers and surrounds the layerstack, and together with the substrate forms an encapsulation. In otherwords, the substrate and the encapsulating structure completely surroundan interior cavity in which the layer stack is arranged. Thus, contactof the layer stack, especially the organic material in the layer stack,with corrosive substances, such as water or oxygen, is prevented.

In some embodiments, the encapsulation is a cap. The cap can include orcan be formed entirely of glass, a ceramic, a plastic, or a combinationthereof. In some embodiments, the cap includes, for example, a colorfilter and/or a fluorescence conversion material. In some embodiments,the cap has no direct contact with the layer stack. Spacer particlesand/or support posts can prevent contact between the cap and the layerstack, as described, for example, in the publications U.S. Pat. No.6,949,880 and U.S. Pat. No. 6,952,078, the contents of which areincorporated by reference. In some embodiments, a better material, forexample, barium, is deposited on the side of the cap facing the layerstack. The better material is suitable, in particular, for chemically orphysically binding gasses that could damage the layer stack. Such bettermaterials are described, for example, in the publications US2004/0051449 and US 2004/0048033, the contents of which are incorporatedherein by reference.

A bonding agent arranged between the substrate and an edge region of thecap connects the cap to the substrate in a mechanically stable way insome embodiments. In some embodiments, the bonding agent is essentiallyimpermeable to water and oxygen or other oxidizing substances, therebycreating a hermetically sealed device. For example, a bonding agent onthe basis of epoxy resin or solder glass can be used.

In an alternative embodiment, the organic light-emitting component isencapsulated with a laminate including at least one polymer and oneinorganic layer, such as with an alternating sequence of several of suchlayers. For example, such a sequence of polymer and inorganic layersincludes at least one active polymer layer, which can be suitable forbinding moisture and/or oxidizing substances, and at least one ceramiclayer. One such layer sequence is disclosed, for example, in thepublication U.S. Publication No. 2004/0239241, the contents of which areincorporated by reference. In at least one embodiment, suchencapsulation is very thin and/or flexible. Advantageously, a componentwith an especially small overall height is achieved with such athin-film encapsulation. In addition, advantageously the production of aflexible component is possible.

In some embodiments, the encapsulating structure completely covers thesubstrate in a plan view onto the substrate. In some embodiments, thesubstrate and the encapsulating structure have edges that are arrangedflush relative to each other in a plan view onto the substrate. Thismeans that the substrate and the encapsulation have the same exteriormeasurements in a plan view of the main surface and are congruent withone another, that is, the substrate and encapsulation have the samelength and width. As an alternative to the flush arrangement, theencapsulating structure can also project past the edge of the substratein a plan view onto the substrate. One part of the encapsulatingstructure in this case is arranged laterally next to the substrate inthe plane of the main surface of the substrate and partially orcompletely covers a side or edge face of the substrate. The side or edgeface is not parallel to the plane of the main extent. In someembodiments, the side face is a circumferential side face, i.e., theside face or faces completely surround the substrate in a top view onthe plane of the main surface. In some embodiments, the encapsulatingstructure is bonded to the side face of the substrate with a bondingagent. For example, the encapsulating structure can have a peripheralstep or recess for holding the substrate. In the area of the step, theside of the substrate facing the layer stack and the side face of thesubstrate can be adhered to the encapsulating structure with a bondingagent.

In some embodiments, the outer surface of the encapsulated component hasno electrical contact surfaces. The outer surface is here the part ofthe surface of the component facing away from the interior, especiallythe faces of the substrate and the encapsulating structure facing awayfrom the layer stack. In other words, no electrical connections and/orconductive lines lead out from the interior, which contains the layerstack and which is enclosed by the encapsulating structure and thesubstrate.

Advantageously, such a component has no electrical feedthroughs betweenthe interior and the exterior. Such electrical feedthroughs can create,for example, diffusion channels, which permit the penetration of waterand/or oxygen or other oxidizing substances into the interior and thusaccelerate the aging of the component. In an organic light-emittingcomponent without external electrical contact surfaces, advantageouslyan active, i.e., radiation emitting, area that is particularly large incomparison with the base surface area of the substrate is also possible,because, for example, no sub-area of the substrate must remain free fromthe layer stack for forming external electrical contact surfaces.

In some embodiments, the receiver device can be used to detect analternating electromagnetic field of a predetermined wavelength or apredetermined wavelength range. The organic light-emitting component isthen used, for example, as an optically emitting high-frequency sensor.The receiver device then directs current into the layer stack, so thatthe stack emits electromagnetic radiation, e.g., light in the visiblespectral range, when and only when the receiver receives anelectromagnetic field of the predetermined wavelength or thepredetermined wavelength range. In some embodiments, the receiver devicecomprises a coil or antenna, which has a length that is tuned to thepredetermined wavelength or the predetermined wavelength range. Thelength of such an antenna equals a whole-number multiple of one-quarteror one-half, of the predetermined wavelength or a wavelength, especiallyan average wavelength, of the predetermined wavelength range in someembodiments.

One such organic light-emitting component is suitable as a displayelement for the operating state of a high-frequency system, for example,a transmission system, for example, for radio. The component can beconstructed as a tag, which is fixed, for example, to clothing. Such adisplay element is suitable for warning maintenance personnel with anoptical signal when they are in the irradiated area of a non-deactivatedtransmission system.

In another embodiment, the organic light-emitting component comprises adata-storage component, which is suitable for storing information.

In one embodiment, the data-storage component is suitable for storingone bit of information. For example, the data-storing component can be“intact” or “destroyed”. The state (“intact” or “destroyed”) of thedata-storing component corresponds to a state (“1” or “0”) of the storedbit. That is, the state of the data-storing component represents the bitof information which is stored and the state of the bit can only beswitched one time. For example, in this case the data-storage device isa capacitor, for example, a film capacitor, which has, in particular, adesired short-circuit point. The capacitor can be part of an oscillator.The state of the capacitor can be detected by probing the resonancefrequency of the oscillator. When the tag with the data-storagecomponent passes a suitable transceiver, e.g., near the doors of astore, an electromagnetic field can be swept around the resonancefrequency of the oscillator to which the capacitor belongs. If the tagis activated, i.e., the capacitor is intact, the oscillator will drawenergy from the field at its resonance frequency and an alarm can betriggered. If the capacitor is destroyed, no extra energy will be drawnfrom the field at the resonance frequency.

In some embodiments, the same alternating electromagnetic field iscapable of being received by the receiver device and causing the organiclight-emitting component to emit electromagnetic radiation and todestroy the data-storing component. An organic light-emitting componentwith such a data-storing component is especially well suited as asecurity tag, for example, for securing goods. In some embodiments, thesecurity tag is deactivated when the data-storing component isdestroyed.

In another embodiment, the data-storage component is a semiconductorcomponent and comprises, in particular, an integrated circuit. Forexample, the semiconductor component involves an RFID (Radio FrequencyIdentification) chip.

An organic light-emitting component with a data-storage component issuitable for emitting electromagnetic radiation—e.g., in the visiblespectral range—when information is to be transmitted from or to thedata-storage component. For example, advantageously a write and/or readoperation on an RFID chip or the deactivation of a security tag can beindicated.

A device can include at least one organic light-emitting component andone control unit, which supplies the receiver device of the component inoperation with electrical energy. The control unit can be galvanicallyseparated, i.e., electrically insulated, from the organic light-emittingcomponent, thus, there is no electrical connection between thecomponent, especially the receiver device, and the control unit.

The separation of the component from the control unit advantageouslyallows the component or the control unit of the device to beindividually replaced, for example, in the case of a defect. Also,replacement of the component with another organic light-emittingcomponent that emits, for example, electromagnetic radiation withanother spectral distribution, is possible in a simple way.

Electrical contacting of the component by means of wires or cables toelectrical contact surfaces is advantageously not necessary here, incontrast to components of conventional construction. Such contactsurfaces are usually thin metal films, so that they are susceptible tomechanical damage and corrosion. The appearance of wear and faults,which occur with components of conventional construction—especiallythose for frequent contacting—is advantageously prevented.

In some embodiments, the control unit is provided for generating analternating electromagnetic field in operation from an alternatingcurrent and/or from a time-varying direct current. For this purpose, atime-varying magnetic field and/or electric field is generated, forexample, by means of a coil and/or an antenna and is decoupled from thecontrol unit. The alternating current or the time-varying direct currenthas, for example, a sinusoidal, rectangular, or triangular profile. Insome embodiments, the alternating electromagnetic field generated by thecontrol unit is inductively coupled into the receiver device of theorganic light-emitting component. Alternatively, the alternatingelectromagnetic field can be capacitatively coupled to the receiver. Insome embodiments, the frequency and/or the intensity of the alternatingelectromagnetic field is tuned to the receiver device. In this way,especially efficient coupling is achieved.

In some embodiments of the device with an organic light-emittingcomponent with a data-storage component suitable for storinginformation, for example, an RFID chip, the device includes a controlunit which is also suitable for transmitting information to thedata-storage component and/or receiving information from this component.In some embodiments, the alternating electromagnetic field generated bythe control unit is used for transmitting both the energy and theinformation. For example, the frequency, the phase, and/or the amplitudeof the alternating electromagnetic field can be modulated in order totransmit the information. In an organic light-emitting component thatconstitutes a security tag, a control unit can be a deactivator whichgenerates an alternating electromagnetic field that is suitable, inparticular, for destroying the data-storage component.

In some embodiments, the receiver device is provided for receiving thetransmitted information—for example, by means of demodulating thealternating electromagnetic field—and transmitting it to thedata-storage component. In at least one embodiment, the receiver deviceis alternatively or additionally provided for transmitting informationfrom the data-storage component to the control unit.

For example, for the transmission of information from the data-storagecomponent to the control unit, in one embodiment, a variant of amplitudemodulation designated as load modulation is used. For load modulation,the magnitude of the electrical energy received, for example, by thereceiver device from the alternating electromagnetic field differs atdifferent times. This is achieved, for example, by turning on and off amodulation resistor of the receiver device. The difference in energydrawn from the alternating electromagnetic field can be detected in thiscase by the control unit.

The frequency of the alternating electromagnetic field generated by thecontrol unit equals, for example, between about 30 and 500 kHz orbetween about 10 and 15 MHz. These frequency ranges are especiallyadvantageous when the organic light-emitting component contains asemiconductor component suitable for storing information.

In another embodiment, the organic light-emitting component is arrangedin or on a holder. The holder can contain the control unit. For example,the holder can have an interior in which the control unit is arranged,or an outer face of the holder and an outer face of the control unit canbe connected to each other in a mechanically stable way.

In one embodiment, the component is connected to the holder in amechanically stable way. Thus, advantageously, a defined arrangement ofthe receiver device relative to the control unit is achieved, so that,for example, the alternating electromagnetic field can be coupled intothe receiver device in an especially efficient way. The connection canbe either reversible—in other words easy to detach—or irreversible, thatis, one of the components is broken in order to break the connection.For example, the component can have at least one holding element, whichhas a support element connecting to the holder. In some embodiments, theconnection of the holding element and support element can be easilydetached, for example, in that the support element and/or the holdingelement are spring-mounted and/or have a flexible construction.

In another embodiment, the control unit is a high-frequency device. Forexample, the high-frequency device involves a microwave system. Such ahigh-frequency device is typically provided for irradiating objects withthe alternating electromagnetic field generated by the device. Theorganic light-emitting component is arranged in the area irradiated bythe alternating electromagnetic field, so that it is supplied withenergy from the alternating electromagnetic field.

For example, the high-frequency device has an interior, in which, duringoperation, objects are inserted and irradiated with the alternatingfield generated by the high-frequency device. The organic light-emittingcomponent can be located in this interior or adjacent to it, so that itis supplied with energy from the generated alternating electromagneticfield.

The organic light-emitting component is advantageously suitable forindicating the operating state of the high-frequency device. Thecomponent usually emits electromagnetic radiation precisely when thehigh-frequency device generates an alternating electromagnetic field.The intensity of the radiation emitted by the organic light-emittingcomponent is dependent on the intensity of the alternatingelectromagnetic field in one embodiment. In other words, the componentis used as an optical control display for such a high-frequency device.

In one variant of this embodiment, a plurality of organic light-emittingcomponents is supplied with energy from one such high-frequency deviceas a control unit. The receiver unit of at least one component is hereconstructed so that the organic light-emitting component only emitselectromagnetic radiation when the alternating electromagnetic fieldgenerated by the control unit exceeds a defined, minimum intensity. Inone embodiment, the receiver units of a plurality of components areconstructed so that they lead to an emission of electromagneticradiation of the organic light-emitting components for different minimumintensities of the alternating electromagnetic field generated by thecontrol unit. For example, the coils or antennas of the receiver deviceshave different geometries and/or different numbers of windings. In thisembodiment, advantageously, conclusions can be drawn on the intensity ofthe electromagnetic radiation generated by the control unit from thepattern formed by the operating state of the components.

In some embodiments, a lighting device includes at least one organiclight-emitting component. Such a lighting device advantageously needs noelectrical supply lines in the surroundings of the light-emittingsurface. In particular, no electrically conductive leads and/or supplylines lead to the organic light-emitting component to supply thiscomponent with energy.

In some embodiments of the lighting device, a control device, whichsupplies the organic light-emitting component with energy by means of analternating electromagnetic field, is provided, for example, on an edgeregion of the lighting device.

For example, the organic light-emitting component is arranged on amiddle area of a glass plate. The middle area of the glass plate, suchas the entire glass plate, can then be free from electrical supplylines, especially from electrically conductive leads.

According to some embodiments, a lighting device comprises a pluralityof organic light-emitting components. These can be arranged flush witheach other at least in one direction in the plane of the main extent ofthe layer stack and together form one or more lighting surfaces. Thelighting surface here can be either flat or curved. In some embodiments,the lighting device represents a display device.

In some embodiments, the layer stack of a component has essentially thesame dimensions as the component itself in the plane of the mainsurface, at least along the direction or the directions, in which thecomponents are arranged flush relative to each other. “Essentially thesame dimensions” here also includes the sense that the component has,for example, an edge region, at which, for example, the cap andsubstrate are adhered and which is free from the layer stack. Such anedge region can, however, be particularly narrow. That is, the layerstack can have smaller dimensions than the substrate or cap, and thedifference between the dimensions of the cap or substrate and the layerstack dimensions is made up by the adhesion region between the substrateand cap in some embodiments.

In some embodiments, the outer surfaces of the component have noelectrical contact surfaces. In other words, there are neither contactsurfaces that are arranged laterally next to the layer stack of acomponent in a plan view onto the substrate, nor are electrical contactsurfaces constructed on the rear side of the components facing away fromthe radiation-emitting side. The surface of non-illuminating areasbetween the layer stacks of the individual components is thereforeespecially small or not present. Advantageously, the viewer does notperceive or does not clearly perceive the boundaries between theindividual components. Thus, advantageously large, essentially uniformlyilluminating surfaces can be produced with organic light-emittingcomponents. In addition, advantageously, no electrically conductivelines or the like are guided outwards from the encapsulated interior ofthe component, where these lines or the like represent permeationchannels, along which water, atmospheric oxygen, and/or other corrosivesubstances penetrate the component and lead to accelerated degradationof the layer stack. The lighting device therefore has a particularlylong service life.

In contrast to conventional lighting devices or display devices, it isnot necessary to connect the individual components to driver electronicselectrically by means of cables, such as, for example, ribbon cables.Advantageously, the time required for the production of the lightingdevice is shortened and economical production is possible.

In some embodiments, the lighting device comprises one or more holders,in or on which the organic light-emitting components are arranged. Aholder can comprise a control unit, which supplies an organiclight-emitting component or a plurality of components with energy. Insome embodiments, a holder and/or a control unit is allocated to eachcomponent.

In one embodiment, the lighting device comprises organic light-emittingcomponents, which emit in different spectral regions. With one suchlighting device, in a simple way, different patterns can be generated.

For producing the organic light-emitting component, in some embodiments,the substrate is provided in the form of a plate or a film, as describedabove. A substrate in the form of a film can be provided as a continuousfilm that is, for example, wound onto a roller. In this way, aneconomical production of the components is possible in an “endlessmethod” (roll-to-roll process).

A first electrode is deposited over or directly onto the substrate. Inthe production of a plurality of components with the method, a firstelectrode layer is deposited in a structured way or structured intoindividual first electrodes after being deposited over the entiresurface.

On the first electrode, a layer stack is produced, which comprises anorganic material, e.g., a low-molecular weight material (“smallmolecules”) and/or a polymer. Low-molecular weight materials can bevapor deposited onto the electrode. Polymers can be deposited using awet-chemical process, such as spin-coating. Also, various printingtechnologies, for example, plate-transfer printing methods, such asoffset printing, pad printing, letterpress printing and gravureprinting, for example, flexographic printing, or inkjet printingmethods, are suitable for applying the layer stack. Such printingmethods are described, for example, in WO 99/07189 A1 the contents ofwhich are incorporated herein by reference.

In some embodiments, an organic layer sequence is applied over theentire surface and then removed from the substrate in some areas, sothat a layer stack or—for the production of a plurality of components—aplurality of layer stacks remains. The removal of the organic layersequence in some areas is performed, for example, by a mechanicalprocess, e.g., with metal blades. Alternatively, a solvent can also beused, which is applied, for example, through a mask or the layersequence is removed in some areas by means of laser ablation. Here, alaser in the ultraviolet spectral range can be used, such as a laserwith wavelengths between about 300 and 400 nm. Preferably, a sub-area ofthe first electrode is also exposed.

Alternatively, a layer stack or a plurality of layer stacks can also begenerated through structured deposition of an organic layer sequenceonto the substrate. Here, the printing methods named above areespecially suitable. In particular, low-molecular weight organicmaterials can also be deposited through thermal vaporization, especiallythrough a mask, onto the substrate. A sub-area of the first electrodecan remain uncovered by the layer stack during its structureddeposition.

Then an encapsulation is deposited onto the substrate and the layerstack. For example, a sequence of organic and inorganic layers, as aredescribed above, is deposited onto the layer stack and onto thesubstrate. The sequence of organic and inorganic layers can completelycover the side of the substrate facing the layer stack.

Alternatively, an encapsulating structure or laminate can also bedeposited, which is a plate or a film. Examples for such encapsulatingstructures are described above. If the encapsulation involves, forexample, a plate, then this can have a recess, which is suitable foraccommodating the layer stack, in other words the recess forms a cavityin which the layer stack is located. On the side of the encapsulationfacing the layer stack, optionally, a better material can be deposited,as described above, in particular in the area of the recess. Theencapsulation here requires advantageously no apertures or cut-outs,e.g., for electrical contact surfaces to the outer surface of thecomponent. In some embodiments, in the plane of the main extent of thelayer stack it has the same dimensions as the substrate.

For the production of a plurality of organic light-emitting components,the encapsulation can be formed as a continuous encapsulation applied toa plurality of layer stacks. In some embodiments, the continuousencapsulation involves a plurality of encapsulations of individualcomponents, which are constructed in an integrated way. The continuousencapsulation can be a simply connected area and with no cut-outs orapertures. In some embodiments, the encapsulation is applied over theentire surface of the substrate.

In one embodiment, a composite that includes the substrate, the layerstack, and the continuous encapsulation is separated into individualparts by cuts forming individual organic light-emitting components,where the cuts severe both the substrate and also the continuousencapsulation. If the first electrode layer has not already beenstructured in a previous processing step, the cuts can alsosimultaneously structure the first electrode layer into individual firstelectrodes. The method thus advantageously allows simple partitioning ofthe composite into individual components by means of straight-line cuts.

The substrate is connected to the encapsulation, for example, by meansof a bonding agent, which is deposited onto the substrate and/or theencapsulation in some areas, e.g., in the form of a bonding agent bead.The bonding agent can be a bonding agent that can be cured thermallyand/or optically, for example, on the basis of an epoxy resin or on thebasis of solder glass. The curing process can include heating and/orirradiating the bonding agent with electromagnetic radiation, especiallyin the infrared and/or ultraviolet spectral range. In one embodiment,the electromagnetic radiation is from a laser. The electromagneticradiation can be focused and/or masked in some areas, so that, forexample, essentially only the positions of the substrate and/or theencapsulation covered with bonding agent are irradiated. Such methodsare described for encapsulating individual components, for example, inUS 2006-0105493 A1, the contents of which is incorporated herein byreference.

The bonding agent can be irradiated through the substrate and/or throughthe encapsulation. Advantageously, there are no conductive leads,electrical supply lines, or the like adjacent to the bonding agent. Suchelectrical supply lines and/or conductive leads can disrupt the curingof the bonding agent. For example, the conductive leads usually havedifferent optical, thermal, and/or physical properties than thesubstrate and/or the encapsulation. Because in the present case thebonding agent does not extend over electrical supply lines and/orconductive leads and also does not have to be irradiated through suchfeatures, the irradiation or heating of the bonding agent is uniformacross the entire bonding agent and homogeneous curing of the bondingagent can be achieved. Thus, an especially hermetic encapsulation ispossible.

Alternatively, the encapsulation can be fused or connected to thesubstrate, for example, by supplying heat and/or by means of a suitablechemical reaction, which, for example, etches the encapsulation and/orthe substrate, especially by means of an etching process.Advantageously, in contrast to conventional components, in the area tobe connected there are no electrically conductive leads and/or contactsurfaces, which could become detached or destroyed in the use of suchconnecting techniques.

Referring to FIGS. 1A and 1B, according to one embodiment, a substrate1, such as a glass plate is provided and a first electrode layer 2 isdeposited on the substrate 1. The first electrode layer 2 can be a layermade from indium-tin oxide (ITO), which is deposited onto the substrate1, such as by a sputtering process. The first electrode layer 2 isstructured to form first electrodes 20, which are suitable to be used asanodes because of the ITO material.

On the first electrode layer 2, an organic active layer sequence 3 isdeposited, such as by a vaporization process. The layer sequence 3 has ahole transport layer 31, which includes, for example, 1-naphDATA and/orα-NPD, adjacent to the first electrode layer 2. The active layersequence 3 also has an active layer 32 suitable for generating radiationand which can include a small molecule material suitable for theemission of electromagnetic radiation, such as Alq₃ and/or DPVBi. Theactive layer sequence 3 further comprises an electron transport layer33, which has, for example, Alq₃ and/or BPhen. Adjacent to this is asecond electrode layer 4, which can also be applied onto the organicactive layer sequence 3 using a vaporization process.

Alternatively, the layer sequence 3 can be deposited using a spinningprocess. In some embodiments, a layer sequence 3 suitable for spinninghas only two layers, which include, for example, a polymer. The twolayers are, for example, a hole transport layer 31 adjacent to the firstelectrode layer 2 and an active layer 32. The hole transport layer 31can include PEDOT and/or the active layer 32 can include PPV and/orpolyfluorene. In some embodiments, the layer sequence also includes atleast one third layer, for example, an electron transport layer 33. Atleast one of the layers in the layer sequence can have at least onepolymer which is cross-linkable. For example, the cross-linkable polymercan be cross-linked through irradiation with electromagnetic radiation.In other words, it is photo-cross-linkable. After cross-linking thecross-linkable polymer, the layer that includes the cross-linkablepolymer is advantageously insoluble in a solvent that is used fordepositing the following layer.

The thickness of the organic layer sequence 3 can be less than or equalto 500 nm or less than or equal to 200 nm.

Cathodes 40 are produced through subsequent structuring of the secondelectrode layer 4. The second electrode layer 4 comprises a thininjection layer of an alkali or alkaline-earth metal, for example,calcium, and a cover layer, which includes, in the present case,aluminum and/or silver.

As shown in FIG. 1B, the organic layer sequence 3 is structured intoindividual layer stacks 300, wherein, in the present case, sub-areas ofthe first electrodes 20 are also exposed. The structuring can beachieved by, for example, laser ablation. In the structuring step, inthe present case, the second electrode layer 4 and the first electrodelayer 2 are also structured into second electrodes 40 and firstelectrodes 20. Alternatively, the first and/or the second electrodelayer 2, 4 can be structured during the deposition. The structuring ofthe organic layer sequence 3 into individual layer stacks 300 canalternatively also be realized before the deposition of the secondelectrode layer 4.

An insulating layer 5 is then deposited onto the second electrode 40 ofa layer stack 300. In the present example, this processing step and thesubsequent processing steps are executed at the same time orsequentially, for a plurality of layer stacks 300, or for all of thelayer stacks 300. The insulating layer in the present example has arecess 51, which leaves open a middle area of the second electrode 40(cf. also FIG. 2A). The insulating layer can be deposited byvaporization or sputtering. It has, for example, Al₂O₃,polytetrafluoroethylene, PS and/or PMMA or is formed entirely of one ofthese materials. Alternatively, the insulating layer can also involve aself-assembled monolayer.

On the exposed sub-area of the first electrode 20, the insulating layer5, and the middle part of the second electrode 40, a conductive linewhich forms antenna 6 is formed such as by vapor deposition through amask (cf. FIG. 1C). For example, the conductive line includes aluminum,silver, gold, and/or copper or is composed entirely of one of thesematerials. In the present example the conductive line has the shape of arectangular spiral, as shown in FIG. 2B.

A first end 61 of the conductive line is located on the exposed sub-areaof the first electrode 20 and a second end 62 of the conductive lead islocated on the middle area of the second electrode 40 in the recess 51of the insulating layer 5. The conductive line forms an antenna 6, whichconnects the first and the second electrode 20, 40 by means of theirends 61, 62 in an electrically conductive way. The substrate 1 is freefrom additional conductive lines in the present example.

A bonding agent 7 is deposited onto the substrate 1 in select areas, asshown in FIG. 1D. In some embodiments, the bonding agent completelysurrounds the layer stack 300 on the main surface of the substrate 1.The bonding agent can be cured, for example, through irradiation, forexample, ultraviolet or infrared radiation, and/or through heating. Thebonding agent 7 includes, for example, an epoxy resin.

Then a continuous encapsulation 8 is deposited onto the substrate 1 (cf.FIG. 1E). The continuous encapsulation 8 is composed of glass in thepresent example and has recesses 81, each of which is suitable foraccommodating one layer stack 300. The continuous encapsulation 8 isarranged on the substrate 1, such that the layer stacks 300 are locatedin the recesses 81. In the present example, the dimensions of the mainsurface of the substrate 1 and the continuous encapsulation 8 are thesame in top view on the main surface of the substrate 1, and the edgesof the substrate 1 and the continuous encapsulation 8 are arranged flushrelative to each other, so that they are congruent in the plan view ontothe substrate 1. The areas between the recesses 81 on the side of thecontinuous encapsulation 8 facing the substrate 1 are wetted at leastpartially by the bonding agent 7 before the bonding agent is cured orhardened.

Then the bonding agent 7 is cured so that a mechanically stableconnection is produced between the continuous encapsulation 8 and thesubstrate 1. The layer stack 300 is here enclosed in the recess 81 sothat to the greatest possible extent, water, atmospheric oxygen, andother corrosive substances cannot penetrate the recess 81 from theoutside.

The bonding agent 7 can be cured, for example, by irradiation withelectromagnetic, e.g., ultraviolet, radiation. The irradiation isperformed, for example, by means of a UV lamp, especially for large-areairradiation, or by means of a laser, whose radiation is, in particular,focused. This is described, for example, in US 2006-0105493 A1, thecontents of which is incorporated herein by reference. In someembodiments, the bonding agent 7 is irradiated through the carriersubstrate 1 and/or through the continuous encapsulation 8.Advantageously, no conductive lines or the like are located in the beampath of the electromagnetic radiation at positions to be bonded, so thatthe irradiation of the bonding agent 7 is performed in all locations asuniformly as possible. In this way, homogeneous curing of the bondingagent 7 is achieved, whereby a hermetic encapsulation is produced.

Then the layer stacks 300 are separated into individual organiclight-emitting components 10 by forming cuts 9 through the continuousencapsulation 8, the bonding agent 7, and the substrate 1 (cf. FIG. 1F).In the present example, only in this processing step is the substrate 1,that is, the carrier substrate for the plurality of layer stacks,divided into individual substrates 100 and the continuous encapsulation8 into individual caps 80.

The component 10 advantageously has no external contact surfaces.Therefore, complicated removal of the organic layer sequence from suchcontact surfaces is eliminated and no sub-area of the substrate 100 needbe provided for holding such contact surfaces. The cap 80 and thesubstrate 100 can therefore, as shown in FIG. 1F, have a positive fit.In addition, there are no electrically conductive tracks, which must beguided between the cap 80 and the substrate 100 out of the interior ofthe component formed by the recess 81 of the cap 80 to the exterior, andwhich, for organic light-emitting components of conventionalconstruction, can represent diffusion channels along which atmosphericoxygen and water can penetrate the interior 81 of the component andaccelerate the aging of the layer stack 300.

In one variant of this embodiment, the antenna 6 has the shape of anoctagonal spiral, as shown in FIG. 2C.

As an example, in FIG. 2C an electronic component 17 is also shown,which is arranged in the present case between the first electrode 20 andthe first end 61 of the antenna 6, for example, on the side of the layerstack 300 facing away from the substrate 100. Alternatively, theelectronic component 17 can also be arranged laterally next to the layerstack 300 on the substrate 100.

In some embodiments, the electronic component 17 includes a diode, whichis provided for rectifying the current directed into the layer stack300. The diode 17 is electrically connected to the first electrode 20and to the first end 61 of the antenna 6, such as by bonding orsoldering the electronic component 17 and/or connection wires thereof,thus completing the current loop.

Alternatively, such an electronic component 17 or a circuit made fromseveral such components 17 can also be constructed in a layeredstructure, in order words, as a sequence of layers, such assemiconductor layers. The layered structure can include an epitaxialsemiconductor layer sequence. At least one layer of the sequence oflayers may be structured in one embodiment. For example, the layeredstructure, can be arranged between the layer stack 300 and the firstelectrode 20.

In the organic light-emitting component 10 according to the embodimentof FIGS. 3A and 3B, instead of a middle area, as in the precedingembodiment, an edge region 51 of the second electrode 40 remainsuncovered by the insulating layer 5. The antenna is constructed as arectangular spiral made from conductive lines. Starting from a first end61 of the antenna 6, which is electrically connected to the firstelectrode 20, on the insulating layer 5 there are windings that extendin the shape of a spiral from an edge region of the insulating layer 5to a middle area of the insulating layer 5. From there, a connectionpiece 63 of the antenna 6 runs back to the edge of the insulating layer5 and transitions into the second end 62, which is arranged in therecess 51 of the insulating layer 5. The second end 62 is electricallyconnected to the second electrode 40. Between the connection piece 63and the windings of the antenna 6 there is a separating layer 16, whichelectrically insulates the connection piece 63 from the windings overwhich it runs. Thus, short-circuiting of the antenna 6 is prevented bythe connection piece 63.

In FIG. 3C, a variant of this embodiment is shown. In contrast to theembodiment of FIGS. 3A and 3B, the antenna 6 is constructed in thisembodiment as a square wave, which is electrically connected to theexposed part of the first electrode 20 and extends from the firstelectrode 20 to the recess 51 of the insulating layer 5 arranged on theopposite side of the organic layer stack 300, where it is alsoelectrically connected to the second electrode 40.

FIG. 3C also shows a data-storage component 18, for example, a filmcapacitor with a desired short-circuit point or an RFID chip, which isconnected electrically to the first end 61 and to the second end 62 ofthe antenna 6 in a parallel circuit to the layer stack 300, for example,by means of connection wires and/or through solder or bonding. Thus, thealternating electromagnetic field received by the antenna 6 isadvantageously also coupled into the data-storage component 18. Forexample, the data-storage component 18 is arranged on the substrate 100next to the layer stack 300 or is adjacent to the side of the layerstack 300 facing away from the substrate 100.

An electronic component 17, which is, for example, a capacitor providedfor voltage smoothing, can also be connected electrically like thedata-storage component 18 in a parallel circuit to the layer stack 300.

The constructions of the recesses 51 and the antenna 6 are not limitedto the geometries described in the first and second embodiment. Instead,they can be adapted accordingly to the corresponding requirements.

In the embodiment shown in FIG. 4, the antenna 6 is not arranged as inthe first two embodiments on the side of the second electrode 40 facingaway from the substrate 100. Instead the antenna is located between thesubstrate 100 and the layer stack 300. Then the first electrode 20 isarranged on the antenna 6. An insulating layer 5 separates the antenna 6from the first electrode 20. Here, the insulating layer 5 has a recess51 into which the first electrode 20 extends. A first end 61 of theantenna 6 is also located in the recess 51, so that an electricalcontact is established between the first electrode 20 and the antenna 6.

Then the layer stack 300 is deposited onto the first electrode 20. Onthis layer stack follows the second electrode 40.

The second end 62 of the antenna projects in this embodiment laterallypast the layer stack 300, so that contact is established with the secondelectrode 40, which, in the present example, is not only arranged on thelayer stack 200, but also is drawn laterally past the layer stacktowards the second end 62 of the antenna 6.

While electromagnetic radiation generated by the layer stack 300 duringoperation in the organic light-emitting component according to the firstand the second embodiment according to FIGS. 1A-3C is transmittedthrough the first electrode 20 and the substrate 100 (“bottom emitter”),the transmission of the electromagnetic radiation in the component 10according to the embodiment of FIG. 4 is essentially through the secondelectrode 40 (“top-emitter”). In this embodiment, therefore, thesubstrate 100 need not be transparent. The first electrode 20 can have areflection coefficient that is as high as possible. In contrast, thesecond electrode 40 is at least partially transparent or translucent toelectromagnetic radiation generated by the layer stack 300 duringoperation. In one construction of the embodiment in FIG. 4, the secondelectrode 40 represents the anode and includes, for example, fromindium-tin oxide. The first electrode 20 then is the cathode andincludes, for example, aluminum.

The device according to the first embodiment shown in FIG. 5A comprisesan organic light-emitting component 10, which is arranged in a holder 15by means of holding elements 11. The holding elements 11 are constructedin the present case as projections from the encapsulation 80. Theseprojections engage in fitting recesses of flexible support elements 12of the holder 15, preferably with a positive fit. Thus, a simple andreproducible alignment of the component 10 can be achieved. At the sametime, the component can be removed in a simple way from the holder 15.Thus, if the component is defective, it can be easily replaced, and thedevice can be tailored to a user's needs, allowing the user to usecomponents 10 with different colors and/or shapes, because thecomponents can be easily interchanged.

In the present case, the holder 15 also includes a control unit 13,which supplies the organic light-emitting component 10 with energy. Thecontrol unit 13 and the component 10 are not electrically connected toone another. Instead, energy is supplied through an alternatingelectromagnetic field (indicated by arrows 14), which is generated bythe control unit 13 by means of a coil and/or antenna from analternating current or a time-varying direct current and which isemitted by the control unit 13. In the present case, the alternatingelectromagnetic field 14 is inductively coupled into the organiclight-emitting component 10 and is received by the receiver device,which in the present case comprises an antenna formed from conductivelines 6. The antenna 6 draws energy from the alternating electromagneticfield 14 and converts this energy into electrical energy. Current istherefore directed into the layer stack 300, which excites the activelayer 32 into emitting electromagnetic radiation.

Electrical contacting by means of bonding pads or the like on the outersurfaces of the component, which is susceptible to defects and istime-consuming, is advantageously unnecessary.

In the device according to the embodiment of FIG. 5B, the organiclight-emitting component 10 is fixed with support elements 12, forexample, metal clamps, to the holding device 15, especially in an easilydetachable way. The holder 15 advantageously has a small overall height.In the present case, an outer surface of the holder 15 is adjacent to amain surface of the encapsulation 80 or the substrate 100; for example,they border each other. In this way, a particularly small height of thedevice is advantageously achieved.

In the variant of this embodiment shown in FIG. 5C, the organiclight-emitting component 10 is arranged in a recess 150 of the holder15. The component 10 partially or completely fills the recess 150. Inparticular, the outer face of the component 10 exposed by the holder 15and the sub-area surrounding the recess 150 of the face of the holder15, which includes the recess 150, lie essentially in one plane. Forexample, at least one support element 12 fixes the component 10 in theholder 15.

In FIG. 5C, as an example for a support element, a clamp 12, such as ametal clamp is shown on the left side of the figure. The clamp 12 isfixed on the sub-area of the holder 15 surrounding the recess 150 andextends past the edge of the component 10 on its surface exposed by theholder 15.

On the right side of the figure, as another example, a locking bar 12 isshown, which is composed of, for example, a plastic material. Thelocking bar 12 is fixed to the holder 15 so that it moves parallel tothe exposed surface of the component 10. An especially simplereplacement of the component 10 is possible with such a locking bar 12.

For example, for an organic light-emitting component that is a securitytag, the connection with the component 10 is realized with the holder15, for example, by means of a bonding agent. The holder 15 is inparticular a good or item, e.g., a retail item, to be secured from theftor loss. In this case, the connection preferably is not easilydetachable.

Particularly when the device comprises an organic light-emittingcomponent 10 with a data-storage component 10, as in this case, theholder 15 preferably does not contain the control unit 13. In someembodiments, the organic light-emitting component 10 is inserted into anarea irradiated by the control unit 13 with the alternatingelectromagnetic field 14, for example, placed on a surface or moved pasta surface.

A light device according to the first embodiment shown in FIG. 6comprises an organic light-emitting component 10, an entire face ofwhich is connected to a holder 15, like a glass plate in the presentexample. The connection can be established, for example, by means of anadhesive film. The holder 15 here has no electrically conductive leadsor supply lines adjacent to the organic light-emitting component 10. Inparticular, no electrically conductive leads and/or supply lines lead tothe organic light-emitting component in order to supply it with energy.

In one variant of this embodiment, the holder 15 comprises a controlunit 13, which represents a microwave system. For example, such amicrowave system comprises an interior, in which objects can be placed,in order to be irradiated with the alternating electromagnetic fieldgenerated by the microwave system, and a door, which closes off theinterior and which is transparent or translucent to light, for example,at least in some areas.

The organic light-emitting component 10 is arranged in the present casein the interior of the microwave system, such as on the side of the doorof the microwave system facing the interior, especially at a position ofthe door that is transparent or translucent to light. In this way, thealternating electromagnetic field 14 generated by the microwave systemis inductively coupled into the component 10, so that this is suppliedwith energy. Such an organic light-emitting component is especially wellsuited for indicating the operating state of the microwave system.

In another variant, the high-frequency device is an induction cooker.The induction cooker has, for example, a cooking surface 15. The organiclight-emitting component 10 is arranged, for example, on the cookingsurface 15. It is located within the area irradiated by thehigh-frequency device with the alternating electromagnetic field andadvantageously indicates the operating state of the induction cooker.

Instead of an individual organic light-emitting component 10, forexample, a plurality of components 10 can be provided for displaying theoperating state of the high-frequency device. In particular, thecomponents 10 are constructed in this case so that the intensity of thealternating electromagnetic field can be read from the lighting patternof the components.

A lighting device according to a second embodiment comprises a pluralityof organic light-emitting components 10. These are arranged in the planeof the main extent of the layer stack 300 flush relative to each other.FIG. 7 shows a cutout of one such lighting device.

Because the organic light-emitting components do not have externalcontact surfaces, electromagnetic radiation emitted from the activelayer 32 of the layer stack 300 is coupled out from a large part, and insome embodiments essentially from the entire visible surface of thecomponent 10. The lighting device therefore has the most uniformlighting surface possible, in which the segments of the lighting surfaceformed by the individual components 10 are not perceived by the vieweras clearly separate.

The invention is not limited to the embodiment examples in thedescription. Instead, the invention comprises any new feature and alsoany combination of features, which contains, in particular, eachcombination of features in the claims, even when this feature or thiscombination itself is not explicitly specified in the claims orembodiments.

1. An organic light-emitting component, comprising: a substrate; a firstelectrode arranged on the substrate; a layer stack arranged on the firstelectrode, which has at least one layer that includes an organicmaterial and that is capable of generating electromagnetic radiation, asecond electrode arranged on the layer stack; and a receiver device fordrawing energy from an alternating electromagnetic field, converting theenergy at least partially into electrical energy, and injecting theelectrical energy into the layer stack.
 2. The organic light-emittingcomponent of claim 1, wherein the receiver device comprises a coil or anantenna.
 3. The organic light-emitting component of claim 2, furthercomprising an insulating layer that at least partially covers the secondelectrode, and on which the antenna or coil is located.
 4. The organiclight-emitting component of claim 3, wherein the insulating layer coversan edge region of the second electrode and exposes a center area of thesecond electrode.
 5. The organic light-emitting component of claim 4,wherein the coil or antenna is connected to the center area of thesecond electrode.
 6. The organic light-emitting component of claim 3,wherein the insulating layer exposes an edge region of the secondelectrode.
 7. The organic light-emitting component of claim 6, whereinthe coil or antenna is connected to the edge region of the secondelectrode.
 8. The organic light-emitting component of claim 1, whereinthe receiver device is configured to rectify alternating current.
 9. Theorganic light-emitting component of claim 8, in which the receiverdevice comprises at least one diode for rectification.
 10. The organiclight-emitting component of claim 1, further comprising an encapsulationon the substrate and enclosing the layer stack together with thesubstrate.
 11. The organic light-emitting component of claim 10, whereinthe encapsulation completely covers a main surface of the substrate. 12.The organic light-emitting component of claim 11, wherein theencapsulation and the substrate have flush edges relative to each otherin a plan view of the substrate.
 13. The organic light-emittingcomponent of claims 10, wherein a surface of the substrate andencapsulation is free from electrical contact surfaces.
 14. The organiclight-emitting component of claim 2, wherein the receiver device istuned to detect an alternating electromagnetic field of a predeterminedwavelength or of a predetermined wavelength range.
 15. The organiclight-emitting component of claim 14 wherein the coil or antenna has alength that is a whole-number multiple of one-quarter of thepredetermined wavelength or a wavelength of the predetermined wavelengthrange.
 16. The organic light-emitting component of claim 1, furthercomprising a data-storage component suitable for storing information.17. A device, comprising: the organic light-emitting component of claim1; and a control unit, which in operation generates an alternatingelectromagnetic field that is received by the receiver device.
 18. Thedevice of claim 17, wherein the organic light-emitting component iselectrically insulated from the control unit.
 19. The device of claim17, wherein the control unit generates the alternating electromagneticfield from an alternating current or from a time-varying direct current.20. The device of claim 19, wherein the alternating electromagneticfield generated by the control unit is inductively coupled into thereceiver device.
 21. The device of claim 17, further comprising a holderconnected to the organic light-emitting component.
 22. The device ofclaim 21, wherein the holder contains the control unit.
 23. The deviceof claim 17, wherein the control unit is a high-frequency device, whichin operation irradiates an area with the alternating electromagneticfield, and the high-frequency device is provided for irradiating objectswith the alternating electromagnetic field and the organiclight-emitting component is in the area.
 24. A lighting devicecomprising a device of claims
 17. 25. The lighting device of claim 24,wherein a plurality of organic light-emitting components are arrangedadjacent and flush relative to each other at least in one direction. 26.A method for producing an organic light-emitting component, comprising:forming a layer stack on a substrate, wherein the layer stack has atleast one layer that includes an organic material and that is suitablefor generating electromagnetic radiation; forming a receiver inelectrical communication with the layer stack; and depositing anencapsulation onto the substrate and over the layer stack and receiverto form the component, wherein the outer surface of the component isfree from electrical contact surfaces.
 27. The method of claim 26,wherein a plurality of organic light-emitting components are formed,comprising: forming a plurality of layer stacks on a single substrateand depositing a continuous encapsulation onto the plurality of layerstacks.
 28. The method of claim 27, wherein the components arepartitioned into individual pieces by cutting the substrate and thecontinuous encapsulation.
 29. The method of claim 27, wherein which thecontinuous encapsulation has recesses for accommodating the layerstacks.
 30. The method of claim 26, further comprising connecting thesubstrate to the encapsulation with a structured connection layer. 31.The method of claim 30, wherein the structured connection layer includesa thermally and/or optically curable material.
 32. The method of claim31, further comprising curing the structured connection layer usingelectromagnetic radiation.